The Third International Symposium on
3D Power Electronics Integration and Manufacturing

3D-PEIM 

June 21-23 2021 

Virtual Symposium Hosted by Osaka University, Japan

PSMA announces the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-21), held June 21-23, 2021. It is the first time to have this 3D-PEIM outside the USA. Asia is the world’s factory and has a significant customer base for advanced power electronics, so it is appropriate to hold this Symposium in Japan at the Osaka University, Suita Campus, Graduate School of Engineering.

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Due to the unforeseen status of the COVID-19 pandemic next June, we have cautiously decided to hold a virtual-only event.  All presentations will be recorded and available to paid attendees.

3D-PEIM has successfully re-invited all the postponed 2020 program world-class experts to present in 2021, with a couple of exceptions. We continue to build on the 2016 and 2018 Symposia’s success, as 3D-PEIM-21 again assembles world-class experts representing a far-reaching range of disciplinary perspectives exploring the path to developing and manufacturing of future 3D power electronics systems. Created and supported by the PSMA Packaging & Manufacturing Committee, the Symposium encompasses additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in deploying smart power-dense components and modules.

3D-PEIM is an excellent opportunity to learn about leading-edge R&D innovations in 3D power packaging. The focus of the Symposium will be on additive, embedded, co-designed, and integrative packaging technologies. The Symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power-dense components and modules.

The conference will feature invited papers highlighted by plenary and keynote addresses by Industry and Academia experts. There will be Exhibits, and NEW THIS YEAR, an Exhibit Sponsors Session. The Symposium is being organized by the Power Sources Manufacturers Association (www.psma.com) Packaging & Manufacturing Committee.

General Chair Professor Tsuyoshi Funaki states, “I am glad we, Osaka University, are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that we are leading 3D-PEIM 2021 because there are many power device and peripheral packaging material manufacturers in Japan. We are planning on providing an amazing virtual experience for all attendees. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this event”.

Exhibit Partnership Opportunities With Virtual Tabletop

Each Exhibit Partner has the opportunity to present products on a 3D-PEIM Virtual Tabletop Website page. To learn more and sign up  to be an Exhibit Partner, go to http://www.3d-peim.org/sponsors-exhibitors//.

Virtual attendees can interact with speakers and the audience during live question and answer sessions. Additional information and registration details are available at www.3D-PEIM.org. or the PSMA office at power@psma.com.  Register and join us at the virtual Symposium June 21-23, 2021.

Join our mailing list to stay informed of the latest news and information for 3D-PEIM 2021 and future 3D-PEIM Events!

                                                                                   

Prof. Tsuyoshi Funaki, Osaka University, Japan
General Chairman

Prof. Katsuaki Suganuma, Osaka University, Japan
Technical Program Co-Chairman

Dr. Minoru Ueshima, Senior Manager, Daicel, Japan
Technical Program Co-Chairman
Prof. Guo-Quan Lu, Virginia Tech, U.S.A.
Technical Program Co-Chairman

Other Organizing Committee Members

Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chairman and Assistant to General Chair
Dr. Minoru Ueshima, Daicel Corporation, Japan – Assistant to Technical Program Co-Chairman
Brian Narveson, Narveson Consulting, U.S.A – Finance Chairman
Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chairman
John Bultitude, Kemet USA – Publications Chairman
Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chairman and advisor
Joe Horzepa, U.S.A. – Executive Director of PSMA
John Horzepa,  PSMA, U.S.A – Webinar Technical Support

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