3D-PEIM 2023 Presentations

The presentation material, slides and session recordings, from 3D-PEIM 2023 is available below.

• 3D-PEIM 2023 Day 1 Proceedings (large download ~40 mb)

• 3D-PEIM 2023 Day 2 Proceedings (large download ~30 mb) 

• 3D-PEIM 2023 Day 3 Proceedings (large download ~20 mb)

• Download individual presentations

Session Recordings:

S1: Plenary I	S2: IVR for Computers and Servers	S3: Multiphysics Design & Tools
S4: Additive Manufacturing	S5: Manufacturing Technologies	S6: Plenary II
S7: Materials I Interconnects & Lead Attachments	S8: Materials II Substrates & Encapsulants	S9: Module Integration
10: Partners Session	S11: Thermal Management and Reliability	S12: Passive Component Integration
S13: Low Power & Telemetry	S14: Plenary III

Presentation Slides:

S1: Plenary I

• Finite-Element Predictive Modeling for Power Modules; Dr. Brandon Passmore, Wolfspeed
• Integrated Power Delivery for AI Computing: Technology Gaps & Opportunities; Prof. Madhavan Swaminathan, Georgia Tech.
  

S2: IVR for Computers and Servers
Chair: Siddharth Ravichandran, Chipletz

• Keynote: Practical challenges with advanced IVR solutions for microprocessors; Michael J. Hill, Intel
• 3D Power Delivery for High Performance Processors; Noah Sturcken, Ferric, Inc.
• Topology and Magnetics Co-Investigation for 48V-1V Point-of-Load VRM; Minjie Chen, Shuai Jiang, Jose A. Cobos, & Brad Lehman, Princeton University
• Inductor-Linked Multi-Output Chiplet Power Delivery Architecture; Daniel H. Zhou, Mian Liao, Ping Wang, & Minjie Chen, Princeton University
  

S3: Multiphysics Design & Tools
Chair: Rajen Murugan, Texas Instruments

• Keynote: Machine-learning-based optimization: the future of power package design; Vanessa Smet, Georgia Tech.
• Keynote: New Challenges in Transportation Electrification, Powertrain Drives &  New Power Electronics Architectures; Osama Mohammed, Florida International University
• Keynote Multiphysics System Co-Design Modeling: State-of-the-Art, Challenges, and Opportunities; Rajen Murugan, Texas Instruments
• EMI Shielding Performance of Thin and Thick Graphene Films Placed Within Integrated Power Modules; Ghaleb Al Duhni, John Volakis, & Markondeyaraj Pulugurtha, Florida International University
• Reliability Analysis of Wireless Power Transfer for Electric Vehicle Charging Based on Continuous Markov Process; Milad Behnamfar,  Arif Sarwat, Md Abu Taher,  Alexis Polowsky, Mohd Tariq & Sukanta Roy, Florida International University

S4: Additive Manufacturing
Chairs: Peter Friedrichs Infineon

• Keynote Nano Additive Manufacturing of Challenging Materials; Wendy Gu, Stanford University
• Additive deposition technologies: from 2D towards 3D electronic systems; Frank Roscher, Fraunhofer Institute

S5: Manufacturing Technologies
Chair: Jason Rouse, Taiyo America

• Keynote; Insights from Microelectronic Packaging for Power Packaging Advancement; Matt Kelly, IPC
• Vertically Integrated High Density Power Packaging Technology; C.P. Hung, Mark Li & Vikas Gupta, ASE
• Reticular Graphene Reinforced Copper for Low-Stress Thermal Management Application; Ambreem Nisar, Cheng Zhang, Markondeyaraj Pulugurtha, Arvind Agarwal, & Al Dunni Ghaleb, Florida International University

S6: Plenary II: Improved Electrical Performance for Power

• PCB based Integrated Magnetics; Prof. Fred C. Lee, Virginia Tech.
• Future of Packaging and the Role of Power Integration; Prof. Rao R. Tummala, 3D Electronic Systems Packaging Research Center(PRC), Georgia Tech.

S7: Materials I Interconnects & Lead Attachments
Chair: Andy Mackie Indium Corporation

• Keynote: Roadmap for Copper Sintering – Next Interconnect for Power Electronic Module Packaging; Gordon Elger, Technische Hochschule Ingolstadt
• Keynote: Die Top System: Advanced interconnect for Power Electronics Module Packaging; Habib Mustain, Heraeus
• Rapid Development of Electrically Conductive Materials for Additive Manufacturing Feasibility and Applications; Gilad Nave, Patrick McCluskey, University of Maryland

S8: Materials II Substrates & Encapsulants
Chair: Ninad Shahane, Texas Instruments

• Keynote: A Polymer-Nanoparticle Composite for  Nonlinear Resistive Field-Grading in Medium-Voltage Power Modules; G. Q. Lu, Virginia Tech.
• Keynote: Substrate technologies for medium-voltage SiC power modules; Christina DiMarino, Virginia Tech.

S9: Module Integration
Chair: John Bultitude KEMET Electronics Corporation

• Keynote: Power Electronic Materials and Devices: Silicon to Diamond; Travis Anderson, US Navy
• Keynote: Heterogeneous Roadmap Update; Patrick McCluskey, University of Maryland
• Towards next generation power module package technology blooming; S. Idaka Mitsubishi, Electric R&D Center Europe
• WAVELET-Based Parameter Estimation of High Voltage Impulse Signals; Emel Onal, Istanbul Technical University
• NMOS/NLDMOS LSS dead-Time Minority Carrier Isolation Optimization; Gang Liu, Olivier Causse, onsemi

S10: Partners Session

• Amkor Technology
• KEMET-Smoltek
• FIU Biomedical Engineering
• Wolfspeed
• Indium Corporation

S11: Thermal Management and Reliability
Chair: Patrick McCluskey, University of Maryland

• Keynote: Integrated thermal management in power electronics and motors; Satish Kumar, Georgia Tech.
• Power Electronics Thermal Design with Carbice Nanotubes for Reliability and Cost Saving; Craig Green, Carbice Corporation
• Inverter/converter power density and flexibility improvements through modularity and novel thermal management architecture; Ian Byers & Stuart Wooters, Marel Power Solutions Inc.

S12: Passive Component Integration
Chair: John Bultitude, KEMET Electronics Corporation

• Keynote: Enabling Sustainable Power Electronics Through Miniaturization and Integration of Power Magnetics; Matt Wilkowski, Enachip
• Application of Circuit Board Technology for Passives Packaging; B. K. Summey, KEMET Electronics Corporation
• High-density nanoporous silicon decoupling capacitors; Mohamed Jatlaoui, Murata
• Cold-sprayed aluminum capacitors for 3D power packaging; Reshmi Banerjee, Denny John, Cheng Zhang, Arvind Agarwal, & Markondeyaraj Pulugurtha, Florida International University
• Class I Multi-Layer Ceramic Capacitors (MLCCs) Performance As Wide Band Gap (WBG) Snubbers for Hard Switching Applications; Allen Templeton, Nathan Reed, Hunter Hayes, James Davis, John Bultitude, KEMET Electronics Corporation

Plenary: Magnetoelectric Nanoparticles As a Wireless Brain-Machine Interface; Sakhrat Khizoev, University of Miami

S13: Low Power & Telemetry
Chair: Girish Wable, Jabil

• Keynote: Energy Harvesting at the Edge: When the Package IS the System; Brian Zahnstecher, PowerRox
• Manufacturing Challenges and Qualification of 3D Packaging; Chuck Woychik, Skywater Technology
• Metamaterial beam steering for wireless power; Hae-In Kim, Y.K. Yoon, University of Florida
• Laminate-Embedded Multimodal Energy Harvester for Multilevel Power Supply; Jorge A. Caripidis Troccola, Sweta Gupta, Maxence Carvalho, Satheesh Bojja Venkatakrishnan, Markondeyaraj Pulugurtha, & John L. Volakis, Florida International University

S14: Plenary III: Improved Electrical Performance for Power

• Superior heat dissipation by low pressure Ag sinter joining and real time AI lifetime prediction for SiC power module; Prof. Katsuaki Suganuma, University of Osaka
• Emerging Power electronics packaging and system integration for automotive applications; Dr. Mahadevan Iyer,  Amkor