The Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) will be held July 8–10, 2025, at the Sheraton Denver West in Lakewood, Colorado, USA. This symposium is sponsored by the Power Sources Manufacturers Association (PSMA) and hosted by the National Renewable Energy Laboratory (NREL), and will cover synergistic advances in component design and integration combined with 3D manufacturing technologies for power electronics packaging. The symposium will be anchored by the following plenary presentations:
“The Power Delivery and Energy Storage Challenge in Advanced Packaging”
Dr. Subramanian Iyer, University of California at Los Angeles
“Beyond 2030: Powering the E-Powertrain with High-Value and High-Efficiency Power Conversion Systems—A BorgWarner Perspective”
Dr. Harsha Nanjundaswamy, BorgWarner
“Advanced Packaging to System Integration – Trends and Challenges”
Dr. Devan Iyer, IPC
Technical Co-Chairs Dr. Sreekant Narumanchi and Dr. Jason Rouse invite Industry, academia, and government researchers and engineers to submit abstracts on the following:
- Technologies for Enabling 3D Manufacturing of Integrated Power Electronics
- Characterization and Modeling Advancements for Manufacturing and Design
- Development of New Enabling Passive Components, Interconnects, Materials, and Thermal Management Technologies
- System and Board-Level Module Integration and Packaging
Please submit your abstracts from September 16, 2024 until November 18, 2024, via the Submission Portal (see below). Notifications of acceptance will be made by December 15, 2024. We encourage invited presenters to submit their work as papers as well. All papers that are accepted for publication will be published by IEEE Xplore as proceedings after the symposium.
On behalf of the Technical Committee, we look forward to receiving your abstracts, which will help us make this another successful 3D-PEIM Symposium. For additional information, contact Dr. Sreekant Narumanchi.
Submission Information
Abstracts will be accepted until November 1, 2024, and acceptance notifications will be made by December 15, 2024. We encourage presenters to publish their work in IEEE Xplore; those that wish to do so will be able to submit their papers as IEEE Xplore conference proceedings after 3D-PEIM concludes.
On behalf of the Technical Committee, we look forward to receiving your abstracts, which will help us make this another successful 3D-PEIM Symposium. For additional information contact Sreekant Narumanchi, Technical Program Chair.
To submit papers, visit: https://epapers2.org/3d-peim2025.
- Check the author information links on the left-hand side.
- Make sure to check the templates.
- Create an author account and submit your paper(s).
Important Dates:
- Website Opens for Abstract Submission: September 16, 2024 (1-page text, and 1 page of figures)
- Due Date for Abstract Submission: November 18, 2024
- Notification of Abstract Acceptance: December 15, 2024
- Submission of Full Paper Drafts: February 15, 2025 (8-page double-column format limit)
- Completion of Reviews of Full Paper Drafts and Reviewer Feedback Provided to Authors: March 23, 2025
- Submission of Final Papers and Copyright Forms: May 30, 2025
- Symposium Date: July 8–10, 2025
