S3.K.J
Session 3 Multiphysics Design & Tools Keynote
Thermal Fluid Simulation Modeling and Structural Analysis of Double-sided Cooling Power Module Based on Thermal Transient Test
Abstract
Thermal management for semiconductor devices is inevitable task to use the devices with its maximum capability. Thermal transient test is physically performed to characterize the heat conductive path from junction to the ambient. The result can be fed into simulation software to create a better thermal fluid simulation model. Furthermore, temperature distribution map as a result of the thermal fluid simulation can be used for structural analysis. Simcenter™ portfolio can fulfil such requirements to achieve the development with digital twins’model, to keep up with the quickly evolving world. Double-sided cooling power module is used to show it as an example.
Biography
Tom Hara, Siemens Digital Industries Software, Japan
Tom HARA received B.E. degree and M.E. degrees from Tokyo Institute of Technology in 2001 and 2003 respectively. In 2003, he joined Keyence Corporation. In 2013, he joined Mentor Graphics Japan Co., Ltd. In 2018, he moved to Siemens DI Software. He works as a technical sales representative for promoting MicReD hardware products. His main topics of interest include thermal management of electric systems, wide band gap semiconductor thermal transient testing, characterization of high power.
S4.K.J
Session 4 Additive Manufacturing Keynote
Developments of High Power Blue Diode Laser Systems for Laser Metal Deposition and Selective Laser Melting in Additive Manufacturing
Abstract
Laser metal deposition (LMD) and selective laser melting (SLM) are useful technologies for the additive manufacturing of metal. A blue diode laser is better than a near-infrared (NIR) laser in shaping pure copper parts because absorptance of blue light on pure copper materials is higher than that of NIR light. We have developed high power blue diode lasers with the wavelength of 450 nm. Blue diode lasers with the output power of 200 W were installed in a multi-beam LMD system in which a powder beam of pure copper was supplied at normal incidence on a stainless steel plate. SLM with a 200 W blue diode laser was also developed for the additive manufacturing of pure copper. Results of the LMD and SLM indicated that blue diode laser was more useful than the NIR laser in the manufacturing.
Biography
Masahiro Tsukamoto, Joining and Welding Research Institute, Osaka University, Japan
Masahiro Tsukamoto got PhD from the Osaka University Graduate School of Engineering in 1994. Assistant professor of Joining and Welding Research Institute, Osaka University from 1994. Associate professor of Osaka University from 2006. Professor of Osaka University from 2017. Project leader of “Research and development of the laser coating technology to realize high value-added design and fabrication” in “Innovative Design/Manufacturing Technologies” of Cross-ministerial Strategic Innovation Promotion Program (2014-2018). R&D manager of “Development of high intensity blue diode laser for next-generation additive manufacturing” in new energy and industrial technology development organization project “R&D of next generation laser processing technology (2016-2020)”.
S6.K.J
Session 6 Manufacturing Technologies Keynote
Development of High Performance SiC Power Module
Abstract
The strong request of CO2 exhaust reduction leads to the strong motivations of realizing the power electronics having the characteristics of lower loss, higher controllability, smaller volume, and lighter weight. Based on this situation, the request for realizing the low loss power module, which shows the high performance such as high switching speed and/or high temperature operation, has been increasing. The power module using SiC is one of the most promising technology for the realization. However, the high performance SiC power module can only be realized by introducing a lot of other technologies such as passive components and their packaging.
In this presentation, the technologies used for the high performance SiC power modules are introduced. In addition, 1.2kV-100A class SiC power module which equipped with embedded passives (resistors and capacitors) and whose maximum junction temperature is 250℃ is introduced as an example.
Biography
Dr. Hiroshi Yamaguchi, National Institute of Advanced Industrial Science and Technology (AIST), Japan
Dr. Hiroshi Yamaguchi received his Ph.D. degree in Electrical and Electronic Engineering from the Tokyo Institute of Technology in 1994. After completing his Ph.D. degree, he was a research associate at the Tokyo Institute of Technology. In 1996, he moved to Electrotechnical Laboratory (ETL). He is now a deputy director of the Advanced Power Electronics Research Center (ADPERC), National Institute of Advanced Industrial Science and Technology (AIST).
His research interests are energy management system, electric power system stabilization, and energy saving technologies using power electronics.
S7.K.E
Session 7 Materials Keynote
Superior Reliability of Power Electronic Packages with Die Top Systems (DTS®). Why a Wire-Based Technology Solution Outperforms Clip-Based Interconnections
Abstract
DTS® maximizes power density and reliability through superior performance of sintering and Cu bonding technology. High power semiconductors that are packaged with sintered silver and copper from both sides can perform more reliable at higher temperatures due to the best thermal conductivity and lowest degradation risk compared to solder. At the same time, thick Cu bond wires enable higher current carrying capability at a lower homologous temperature than Al wires can provide. Coupled with a one-step sinter process and a well-established and extremely flexible wire bonding process, the DTS® outperforms clip-based interconnections, especially when it comes to design changes. Proven in many Power Cycling Tests, the DTS® even exceeds performance when Molybdenum is used.
Biography
Michael Joerger, Heraeus Electronics, Germany
Since 2015 Dr. Michael Jörger is heading the global Innovation organization as Executive Vice President at Heraeus Electronics headquartered in Hanau, Germany. Prior to that, he was responsible for R&D in the Electronic Materials and Thick Film Division. Before starting his career at Heraeus, Michael worked as Business Manager and R&D Manager at Rolls-Royce plc. in Derby, UK for 7 years. He has successfully launched products for the Electronics, Renewable Energy, and Aerospace industry. Michael Jörger majored in chemistry at the University of Karlsruhe, Germany, and he received his Ph.D. in Materials Sciences with a focus on ceramics from ETH, Zurich, Switzerland.
S8.K.E
Session 8 Heterogeneous Integration Keynote
The Technology Race in Power Electronics Packaging: The race is on!
Abstract
Technology diversity for power electronics packaging today is at a high, even though a plethora of these just popping up from all over the world whilst involving different industries. High-density interconnections with a high degree of design flexibility, superior thermal conduction as well as low-cost are the main criteria to be successful in the competition for next generation traction inverters, SMPS or DC fast chargers.
Summing up decades of research and development for packaging of power devices, Mr. Frauwallner will talk about state-of-the-art solutions as well as tech trends and innovations. AT&S’s keynote speech will present the company’s strategic view on 3D integration of active and passive components into FR4-based organic laminate substrates to meet challenging requirements for thermal and electrical
performance.
Biography
Rainer Frauwallner AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Austria
Rainer Frauwallner has worked across multiple technical functions in AT&S related to active and passive component embedding into organic laminate substrates. Within these roles, he was responsible for technical sales, concept development, and product analysis for projects realized with AT&S ECP® technology. In his current position, he evaluates the requirements of strategic applications and defines gaps to available technologies in order to further improve products and enable new solutions for customers. Besides his international experience in automotive and industrial electronics from former employments, he is holding a master’s degree in “Advanced Electronic Engineering” from the University of Applied Sciences FH Joanneum in Kapfenberg, Austria.
Plenary Speakers Abstracts and Biographies
Invited Speakers Biographies
